High-power LED packaging technology
fecha:2010-11-24 16:20
very important. TIM LED package commonly used for the conductive plastic and thermal plastic, the low thermal conductivity, generally 0.5-2.5W/mK, resulting in high interfacial thermal resistance. The low temperature or eutectic solder, solder paste or conductive nanoparticles doped within the gel as a thermal interface material, can greatly reduce the interface thermal resistance.
(B) high rate of take-ray structure and technology package
LED used in the process, the radiative recombination o
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10/22 21:26