LED packaging structure and technology of multiple forms of
fecha:2011-06-07 15:08
estado:para resolver
pregunta:admin
number of impurities, lattice defects and dislocations to improve internal efficiency, while improving the internal structure of the die and package, enhanced LED internally generated photons emitted chance to improve the light efficiency, solve the heat, get light and heat sink optimization of design, improved optical performance, speed up the process of SMD surface mount technology is the main direction of industry R D .
Type of product packaging structure has been since the nineties of last
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