LED packaging structure and technology of multiple forms of
fecha:2011-06-07 15:08
estado:para resolver
pregunta:admin
t economical solution, placed in a typical traditional LED 0.1W input power can withstand the encapsulation within the 90% of the heat is from the negative pin distributed to the PCB board rack, and then released into the air, how to reduce the working pn junction temperature rise is packaged with the application must be considered. Encapsulation materials, high temperature curing epoxy resin and more, its light performance, process adaptability, high reliability, can be made transparent and col
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