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fecha:2011-05-16 11:26
estado:para resolver
pregunta:admin
solder joint shape, tension.






Welding of pressure-depth study of various issues involved, such as gold (aluminum) wire materials, ultrasonic power, bonding stress, wedges (wedge) selection, wedges (wedge) trajectory and so forth.






9. Dispensing package






LED package main some glue, potting, molding of three.






Basically, the difficulty is the bubble process control, multi-material shortage, black spots. Designed mainly for material selection, combined with a good selection of
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