Xiamen Municipal People's Government Office of Economic Development Board on the issuance of Tec
fecha:2011-05-18 10:15
estado:para resolver
pregunta:admin
ished package. Focus on the development of advanced technologies and products for packaging, including chip-type package, flexible substrate-style package, a small white chip packaging and power type package; combination of modules; phosphor and packaging materials research and production.
3. Applications. Focus on the development of two types, one can simultaneously stimulate the local upstream, midstream industry backlighting, automotive lighting, urban street lighting, interior lights and ot
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